发明名称 Wet oxidation method for forming silicon oxide dielectric layer
摘要 A method for forming a silicon oxide gate oxide dielectric layer upon a silicon semiconductor substrate employed within a microelectronics fabrication. There is provided a silicon semiconductor substrate. There is then formed upon the silicon semiconductor substrate, empolying thermal annealing of the silicon semiconductor substrate at an elevated temperature in a gas mixture of oxygen, hydrogen and a diluent gas, a silicon oxide gate oxide dielectric layer with enhanced dielectric properties and more precise control of the silicon oxide dielectric layer thickness.
申请公布号 US6211098(B1) 申请公布日期 2001.04.03
申请号 US19990252337 申请日期 1999.02.18
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 TWU JIH-CHURNG;JANG SYUN-MING;YU CHEN-HUA
分类号 H01L21/28;H01L29/51;(IPC1-7):H01L21/26 主分类号 H01L21/28
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