发明名称 Cu-Ni-Zn-Pd alloys
摘要 A family of copper-nickel-zinc-palladium alloys for sliding and static electrical contact applications comprises, on a weight percent basis, about 15-65 percent copper, up to about 30 percent nickel, about 5-30 percent zinc, about 5-45 percent palladium, and up to about 35 percent silver. One embodiment of the family of alloys is age hardenable and provides alloys with hardness values in excess of 300 Knoop (100g load) and significant improvement in high-temperature properties, formability, tensile strength and ductility. A second embodiment provides an alloy with increased strength and hardness in the wrought condition, relative to the prior art Cu-Ni-Zn alloys.
申请公布号 US6210636(B1) 申请公布日期 2001.04.03
申请号 US19990303244 申请日期 1999.04.30
申请人 THE J. M. NEY COMPANY 发明人 KLEIN ARTHUR S.
分类号 C22C1/03;C22C9/04;C22C9/06;C22C30/02;C22C30/06;(IPC1-7):C22C9/04;C22C30/00 主分类号 C22C1/03
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