发明名称 |
Data medium in card form and lead frame for use in such a data medium |
摘要 |
A data medium in card form has a least one semiconductor memory element with a storage capacity of at least one megabit and has electroplated contacts for transmission of data between a data processing system the semiconductor memory elements of the data medium. Electrical conductor paths on the data medium connect the semiconductor memory element to the electroplated contacts. The electrical conductor paths are a single leadframe on which at least parts of the electroplated contacts are integrally formed. The leadframe is formed of a resilient material.
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申请公布号 |
US6209790(B1) |
申请公布日期 |
2001.04.03 |
申请号 |
US19970930236 |
申请日期 |
1997.09.26 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HOUDEAU DETLEF;KIRSCHBAUER JOSEF;FILSER CHRISTOPH |
分类号 |
G06K19/077;H01L23/538;(IPC1-7):G06K19/06 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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