METHOD FOR EXHAUSTING THERMALLY ORGANIC COMPOUNDS OF WAFER

摘要

PURPOSE: A method for exhausting thermally organic compounds of a wafer is provided to exhaust organic compounds from a wafer by using an additional device for exhausting the organic compounds. CONSTITUTION: A lower plate(1) of a chamber is formed with a wafer support plate(2) and an O-ring(3). A thermal sensor(4) is adhered to one side of the lower plate(1) of the chamber. A clamp(5) is used for contacting closely an upper plate of the chamber with the lower plate(1) of the chamber. A wafer is loaded within a chamber. An absorbing trap is installed to a gas exhaust hole of the chamber. An inert carrier gas is provided to the gas injection hole of the chamber. Organic compounds are exhausted from the wafer by heating the chamber. The exhausted organic compounds are collected in the absorbing trap.