| 摘要 |
PROBLEM TO BE SOLVED: To provide an exhaust gas treatment apparatus capable of being miniaturized and reduced in production cost by employing constitution rapidly heat-treating exhaust gas in a catalytic reducing process without preheating the same. SOLUTION: An exhaust gas treatment apparatus is equipped with a powder removing process for changing NH3, SiH4, N2, N2O or the like discharged in a semiconductor wafer manufacturing process to SiO2 being a powder by oxidizing reaction to remove SiO2 by a filter 13, an NH3 removing process for introducing NH3 contained in the exhaust gas into a reducing reaction tank 18 having catalyst beds 20... and feeding hot air into the tank 18 by a hot air blower 21 to reduce NH3 to N2 by a selective catalytic reducing method and a cooling process for cooling the high temp. exhaust gas immediately after passed through the NH3 removing process. |
