| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive polyimide precursor composition for i-ray exposure which possesses good i-ray fabricability, oxidative deterioration resistance and adhesion and gives a developed pattern peelable with an alkali aqueous solution. SOLUTION: The photosensitive polyimide precursor composition for i-ray exposure (a) has a structure unit represented by formula 1 having molecular weight of not more than 600 (wherein R1 is a tetravalent organic group; R2 is a divalent organic group; and R3 is at least one selected from hydrogen, an alkali metal ion, ammonium ion and a 1-30C organic group) and (b) contains an amine compound represented by formula 7 and is characterized in that a 10 μm thickness pre-baked film shows light transmittance at 365 nm of 3 to 70% (wherein R8, R9 and R10 are each 1 to 30C organic groups and at least one of them contains an ethylenically unsaturated group). |
