| 摘要 |
PROBLEM TO BE SOLVED: To provide an aluminum nitride sintered body capable of manufacturing such a highly reliable circuit board that remarkably reduced cracks are caused in an aluminum nitride substrate after thermal treatment of the circuit board even when the material of a circuit of heat sink, on the aluminum nitride substrate is copper. SOLUTION: This sintered body consists of aluminum nitride particles which has a 3-7 μm average particle size, a <=30 μm maximum particle size and a 3-15% of number frequency of particles having 10-20 μm particle size, and has a >=3.0 MPa.m1/2 fracture toughness value K1C measured by the IF method and a >=170 W/mK thermal conductivity measured by a laser flash method and a >=450 MPa three-point flexural strength value. |
