| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition improved in moldability and adhesion to substrates or the like without deteriorating the heat resistance as a characteristic of maleimide resin itself. SOLUTION: This thermosetting resin composition essentially comprises 100 pts.wt. of a maleimide resin and pref. 5-200 pts.wt. of a triazole compound.
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