| 摘要 |
A circuit board includes a semiconductor socket which permits insertion of gull wing semiconductor integrated circuit devices with gull wing contacts. The socketed devices are retained in an inverted alignment. Ribs are used to align the gull wing contacts and ridges are used to isolate split contacts. The isolation of the split contacts permits the use of aligned leads of different ones of the stacked devices. The socket may be mounted beneath the circuit board. This permits stacking and/or socketing of such integrated circuit devices, and further permits alignment of such socketed devices beneath similar devices which are surface mounted to the circuit board, by mounting the socket on the circuit board's opposite (backplane) side. In one configuration, multiple integrated circuit devices may be inserted into the socket in a stacked arrangement. The socket permits the socketing of integrated devices which are packaged for fusion bonding applications. The socket may be provided with soft material for the purpose of permitting good ohmic contact, and may further be provided with sufficient solder material for purposes of fusion bonding the integrated circuit devices subsequent to insertion.
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