INSULATING RESIN ADHESIVE FOR MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To develop an interlayer insulating adhesive for multilayer printed circuit board exhibiting flame retardancy without using a halogen or phosphorus and excellent in storage stability and heat resistance. SOLUTION: This interlayer insulating adhesive for multilayer printed circuit board comprises (1) a thermoplastic resin having sulfone group and 103-105 weight-average molecular weight, (2) an inorganic filler, (3) a multifunctional epoxy resin having <=500 epoxy equivalent and (4) an epoxy resin curing agent as essential components.