| 摘要 |
PROBLEM TO BE SOLVED: To provide a baking resin composition capable of being baked even at a low temperature, especially a baking photosensitive resin composition, and to provide a process for forming a ceramic pattern using the photosensitive resin composition. SOLUTION: A baking resin composition or a baking photosensitive resin composition contains a resin and a metal peroxide and can give a ceramic pattern by processes comprising the forming of a layer of the photosensitive resin composition on a base board, then the light exposing and developing via a pattern mask, thus the forming on the base board of a resist pattern with unevenness, subsequently the filling of a ceramic material in the concave parts on the resist pattern, thereafter the baking of both the resist pattern and the ceramic material to thereby form the ceramic partition wall. |
