| 摘要 |
There is provided an adhering structure between a semiconductor chip and two alignments of first side inner leads and second side inner leads extending in first and second sides of the semiconductor chip respectively. Each of the first and second side inner leads has a stitched portion. The first and second sides are separated by a center line of the semiconductor chip. The semiconductor chip and the first and second side inner leads are adhered to each other by first and second side electrically insulative adhesive tapes respectively. Each of the first and second side electrically insulative adhesive tapes has both surfaces with adhesion force. The first and second side electrically insulative adhesive tapes extend on first and second inner stripe regions so as to adhere the stitched portions of the first and second side inner leads respectively. It is also important that each of the first and second side electrically insulative adhesive tapes is further present in at least two positions which are spaced from each other in a direction parallel to the center line and which are also located in the vicinity of an edge of the semiconductor chip, where the edge extends substantially in parallel to the center line, so that the inner leads, which extend through the two positions, are also fixed in the vicinity of the edge of the semiconductor chip.
|
