| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition which alleviates the pressure applied to a sealing resin, shows an improved crack resistance in a thermal crack test and is therefore suitable for liquid sealing of semiconductors. SOLUTION: This liquid sealing resin composition essentially comprises (A) an epoxy resin such as a bisphenol F type epoxy resin, (B) a liquid rubber- modified epoxy resin prepared by modifying an epoxy resin with a liquid rubber such as a liquid NBR containing a carboxy group, (C) a hardener, (D) an accelerator and (E) a filler. Here, the number of cycles completed without any failure in a heat cycle test of from -65 to 150 deg.C is remarkably increased.
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