发明名称 |
INK PRINTING METHOD OF SUBSTRATE |
摘要 |
PURPOSE: An ink printing method of a substrate is provided to completely fill inside of a hole with ink and apply the ink on the substrate by a desired thickness, simultaneously, by printing the ink with one reciprocation of a squeeze. CONSTITUTION: In an ink printing method of a substrate, a printing plate(7) gets closed to a pre-processed substrate(1) with an interval of 40-45 mm. The substrate(1) has a hole. A squeeze presses the printing plate(7) to fill the inside of the hole with ink(9). The squeeze(8) proceeds from a position A to a position B at a first stroke and returns back to the position A at a second stroke. The first stroke from A to B proceeds at a pressure of 3.5kgf/cm¬2 and a speed of 60-70mm to fill the hole by about 70%. The second stroke from B to A proceeds at a pressure of 2.0kgf/cm¬2 and a speed of 130-150mm/min to fill the hole by about 40%. With the first and the second strokes, the hole is filled with the ink(9) by 110% so as to apply the ink(9) on the substrate(1).
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申请公布号 |
KR100276261(B1) |
申请公布日期 |
2001.04.02 |
申请号 |
KR19970066487 |
申请日期 |
1997.12.06 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, JEONG MAN;KIM, JONG HO |
分类号 |
(IPC1-7):H05K3/00 |
主分类号 |
(IPC1-7):H05K3/00 |
代理机构 |
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主权项 |
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