发明名称 INK PRINTING METHOD OF SUBSTRATE
摘要 PURPOSE: An ink printing method of a substrate is provided to completely fill inside of a hole with ink and apply the ink on the substrate by a desired thickness, simultaneously, by printing the ink with one reciprocation of a squeeze. CONSTITUTION: In an ink printing method of a substrate, a printing plate(7) gets closed to a pre-processed substrate(1) with an interval of 40-45 mm. The substrate(1) has a hole. A squeeze presses the printing plate(7) to fill the inside of the hole with ink(9). The squeeze(8) proceeds from a position A to a position B at a first stroke and returns back to the position A at a second stroke. The first stroke from A to B proceeds at a pressure of 3.5kgf/cm¬2 and a speed of 60-70mm to fill the hole by about 70%. The second stroke from B to A proceeds at a pressure of 2.0kgf/cm¬2 and a speed of 130-150mm/min to fill the hole by about 40%. With the first and the second strokes, the hole is filled with the ink(9) by 110% so as to apply the ink(9) on the substrate(1).
申请公布号 KR100276261(B1) 申请公布日期 2001.04.02
申请号 KR19970066487 申请日期 1997.12.06
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JEONG MAN;KIM, JONG HO
分类号 (IPC1-7):H05K3/00 主分类号 (IPC1-7):H05K3/00
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