LEAD FREE SOLDER PASTE

摘要

PURPOSE: Provided is Sn-Ag-Si-Bi based lead free solder, which has superior mechanical strength at high temperatures. This lead free solder has melting point applicable for wiring of electronic components as well as is suitable to automatic welding due to its narrow solidification temperature ranges. CONSTITUTION: The lead free solder comprises Ag 3.0-4.5wt.%, Si 0.05-0.3wt.%, Bi 5-10wt.%, and a balance of Sn, wherein solidus curve is 195 to 205deg.C and liquidus temperature is 210 to 218deg.C.