发明名称 TEMPORARY BONDING APPARATUS FOR MULTI-LAYER SUBSTRATE
摘要 PURPOSE: A temporary bonding apparatus is provided to reduce manufacturing cost by eliminating the need of using an eyelet, while preventing short cause due to brass powder. CONSTITUTION: A temporary bonding apparatus comprises a main body(5); a jig plate(6) where a plurality of substrates(1) with aligned patterns are mounted, and which has a plurality of cut-out portions(7) formed in a lengthwise direction; upper and lower fusion heaters(13a,13b) installed to an installation plate(12), in such a manner that upper and lower fusion heaters are movable in a vertical direction, and which move in an opposite direction so as to fusion-splice the substrate mounted onto the jig plate; and a drive unit for driving the upper and lower fusion heaters in an opposite direction.
申请公布号 KR100276209(B1) 申请公布日期 2001.04.02
申请号 KR19980029688 申请日期 1998.07.23
申请人 HAN SONG HI-TECH CO., LTD. 发明人 SHIN, MUN HYEON
分类号 (IPC1-7):H05K3/46 主分类号 (IPC1-7):H05K3/46
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