| 摘要 |
A method and apparatus improve the thermal interface between a heat sink and a semiconductor. A support member is attached to a bias plate to facilitate a fixed connection with a surface. The bias plate has a beam for alignment with a heat sink that is attached to the semiconductor. The bias plate is attached to the support member such that the support member forces the beam against the heat sink to improve the thermal interface between the heat sink and the semiconductor.In the method, a heat sink is attached to a semiconductor, and a pivoting beam is biased against the heat sink such that the thermal interface with the semiconductor is improved.
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