| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing multilayer printed wiring board, where a rough surface comprising a constant rough is formed at the formation of a rough surface on the surface of an interlayer resin insulating layer, while no peeling occurs between the interlayer resin insulating layer and a conductor circuit comprising a metal layer. SOLUTION: A conductor circuit 4 and an interlayer resin insulating layer 2 are laminated sequentially on a substrate. Here, at the formation of the interlayer resin insulating layer 2, resin film such as particles 22 soluble in acid or an oxidant dispersed on in a resin 21, which is hardly soluble in acid or oxidant is press-fitted temporarily to a substrate surface comprising a conductor circuit at a pressure of 1.0-7.0 kg/cm2, and then under reduced pressure or vacuum, it is appropriately press-fitted at a pressure of 2.0-10 kg/cm2, forming a non-through hole and/or through-hole. |
