| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method and an inspection method for a multilayer interconnection substrate, where occurrence of delamination is easily detected, a multilayer interconnection substrate where delamination is hard to occur, and a multilayer interconnection substrate where delamination is easily detected. SOLUTION: A multilayer interconnection substrate 100 comprises a core insulating layer 103, a tabular solid copper layer 101, a first resin insulating layer 104 formed on its outside surface 102S, a mesh-like copper layer 102, which formed on the outside surface, faces the solid copper layer 102 via the first resin insulating layer 104 in-between, while comprising multiple openings 102P, and a second resin insulating layer 105 which, formed on the outside surface 102S of the mesh-like copper layer 102, makes tight contact with the first resin insulating layer 104 via the opening 102P. HAST is performed with the solid copper layer 101 is set as a positive pole, while the mesh-like copper layer 102 is set as a negative pole, and if delamination DLL takes place, it is easily discriminated using an swelling 105SF. |
