| 摘要 |
PROBLEM TO BE SOLVED: To avoid depositing solder to the interface of bump electrodes and wiring pads of a flip chip with possibility suppressing the cost up, in a method of mounting the flip chip on a substrate by soldering it via the Au bump electrodes formed by the wire bonding method on the Al wiring pads. SOLUTION: This electronic component mounting method comprises a step of covering at least the surfaces of wiring pads 2 and bump electrodes 4 with a liquid or half hardened resin film 5 on a flip chip 10, a step or pressing the top ends of the bump electrodes 4 to solder 7 sufficient to exclude the resin film 5a, thereby making the top ends of the bump electrodes 4 contact with the solder 7, while facing one surface of the flip chip 10 at one surface of a substrate 8 with leaving the resin film 5 liquid or half hardened, and a step of hardening the resin film 5 and melting the solder 7 to electrically connect the bump electrodes 4 to lands 6. |
