| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper clad silicon nitride circuit board, which has higher durability and reliability to heat cycles and thermal shocks, as compared with the conventional boards. SOLUTION: For this copper clad silicon nitride substrate, a copper plate is brazed to the at least one side of itself, and the universal hardness at a position of 100 μm from the interface between the silicon nitride and the copper to the side of the above copper plate is 1,200 HU or lower. In this case, the thermal stress generated at the interface is relaxed to some degree by the deformation of the copper plate, so satisfactory heat cycle resistance and thermal shock resistance can be obtained. |
