EQUIPMENT AND METHOD FOR PLASMA TREATMENT

摘要

PROBLEM TO BE SOLVED: To prevent the deposition of a reactive product which can adversely affect wafer treatment conditions. SOLUTION: Deposition of a reactive product is related to a temperature of a part to be deposited with the reactive product. It is known that it is hard to have a reactive deposited on a high temperature part. In order to raise the temperature of a part which is expected to be deposited with a reactive product to prevent the deposition of the reactive product, a gas supply plate 1 and an inner tube 3 are integrated into a single unit, and the deposition of the reactive product is prevented using heat transfer from the inner tube.