| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the cost of an IC module and to provide the IC module and a composite type IC card with high terminal connection reliability at the time of assembly. SOLUTION: Terminal electrodes 12a-12h divided into eight pieces and a land 13 are formed on the surface of a chip substrate, an opening part is formed on the chip substrate of a back surface and a connection terminal, a bump forming hole and an IC chip loading area are formed. An IC chip is stuck to the IC chip loading area with a conductive adhesive material, the pad electrode of the IC chip and the connection terminal are connected by wire bonding and the IC chip is resin-sealed. Then, a connection bump 51 is formed by filling, raising and molding cream solder or the like in the bump forming hole, an adhesive sheet 61 is stuck to a chip substrate side and this IC module 10 is obtained. The IC module 10 is mounted on a card 71 incorporating an antenna coil and an antenna coil connection terminal and this composite IC card 20 is obtained.</p> |
