| 摘要 |
<p>PROBLEM TO BE SOLVED: To cope with an EMI noise without having to change the impedance of signal wiring on the ground conductor layer of large area, related to a multilayer interconnection substrate comprising parallel wirings. SOLUTION: On a first insulating layer I2 comprising first parallel wirings L1 comprising signal wiring, a second insulating layer I2 including second parallel wirings L2 that are orthogonal to the first parallel wirings L1 and comprise a signal wiring S2 is laminated, with the first and second parallel wirings L1 and L2 electrically connected with through conductors constituting a laminated wiring body. Over the I2, a third insulating layer I3 comprising a ground conductor layer GL which faces the parallel wirings L2 is laminated, and a thickness w2 of the wiring layer of the second parallel wirings L2 which face the ground conductor layer GL is made smaller than a thickness w1 of the wiring layer of such first parallel wirings L1 which does not face it. Thus, no mismatch in impedance of the signal wiring is caused, enabling coping with EMI noise.</p> |
