| 摘要 |
PROBLEM TO BE SOLVED: To obtain an apparatus and a method for dicing a semiconductor wafer, capable of simply and effectively dividing the wafer without damaging an element when dicing the wafer having elements each of which has a microscopic bridge structure. SOLUTION: This apparatus for dicing a wafer comprises at least a wafer support base 1, having a recess surface of a prescribed radius of curvature, a wafer support jig for fixing a wafer 2 having an adhesive sheet adhered to its rear surface to the base, a knife edge 4 having a straight sharp protrusion, and a pin 5 having a dot-like sharp protrusion. The method for dicing the water comprises the steps of applying impacts on the wafer by means 8, 9, provided at the top of the knife edge or the pin to apply the impact to the wafer, while exerting a prescribed load to the wafer by a means 7 provided at the top of the knife edge to exert a load to divide the wafer. |
