摘要 |
PROBLEM TO BE SOLVED: To reduce the adjusting error of a film for forming build-up layer pattern by adjusting the target mark of the film for forming build-up layer pattern and a pattern adjusting mark. SOLUTION: The copper foil of copper foil with resin in a build-up layer is partially hollowed and removed so that a pattern adjusting mark 2 in a lower layer can be read through the build-up layer (3 in (1)). The pattern marks 2 at four corners are read by a camera, the expansion/contraction of a base material is calculated from the mutual position relation and the corrected film for forming build-up layer pattern is outputted by reflecting a calculation result. The corrected film is overlapped with a work board to which dry film for etching resist is sealed. The positions of a film target mark and the pattern adjusting mark 2 on the film are positioned and they are exposed and etched. Thus, the pattern of the build-up layer is formed (2). |