发明名称 RESIST REMOVING SOLUTION COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resist removing solution composition having both strong removing action by which residue difficult to remove, e.g. a degenerated layer can be removed and superior anticorrosive action by which the degeneration of a metallic film liable to corrosion, e.g. a copper film can be prevented, having small temperature dependency of the balance of the removing performance and anticorrosive performance and less liable to produce residue after rinse. SOLUTION: The resist removing solution composition consists of (a) the salt of hydrofluoric acid and a metal ion-free base, (b) a water-soluble organic solvent, (c) water and (d) a benzotriazole derivative of the formula. The components (a), (b), (c) and (d) are preferably contained by 0.2-30 wt.%,, 30-80 wt.%, 10-50 wt.% and 0.1-10 wt.%, respectively. In the formula, R1 and R2 are each 1-3C hydroxyalkyl or alkoxyalkyl and R3 and R4 are each H or l-3C alkyl.
申请公布号 JP2001083712(A) 申请公布日期 2001.03.30
申请号 JP19990257615 申请日期 1999.09.10
申请人 NEC CORP;TOKYO OHKA KOGYO CO LTD 发明人 AOKI HIDEMITSU;NAKABEPPU KENICHI;TANABE MASAHITO;WAKIYA KAZUMASA;KOBAYASHI MASAICHI
分类号 H01L21/027;G03F7/42;H01L21/02;(IPC1-7):G03F7/42 主分类号 H01L21/027
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