发明名称 ABSORPTION HEAT PUMP DEVICE
摘要 PROBLEM TO BE SOLVED: To discharge noncondensible gas hardly containing almost no refrigerant vapor. SOLUTION: An absorption heat pump device comprises a resorber 5 to absorb refrigerant vapor, supplied from evaporator 3, in absorption liquid; and a desorber 6 to heat absorption liquid supplied from the resorber 5 and evaporate and separate a refrigerant and return the absorption liquid to the resorber 5 and supply refrigerant vapor to an absorber 4, as well as a reproducer 1, a condenser 2, the evaporator 3, and the absorber 4. A heat-exchanger 10 is provided to effect heat-exchange between partial absorption liquid branched from absorption liquid returned to the reproducer 1 from the absorber 4 and returned to the absorber 4 through an extraction device 9 and absorption liquid returned to the resorber 5 from the desorber 6. By reducing the temperature of absorption liquid flowing in the extraction device 9, the steam pressure of the absorption liquid is reduced and this constitution absorbs and captures noncondensible gas of the absorber 4 through a noncondensible gas capturing pipe 18 by the extraction device 9 together with refrigerant vapor. Further, the gas phases of the condenser 2 and the resorber 5 and the gas phases of the resorber 5 and the absorber 4 are intercoupled through gas pipes 20 and 21.
申请公布号 JP2001082838(A) 申请公布日期 2001.03.30
申请号 JP19990254768 申请日期 1999.09.08
申请人 SANYO ELECTRIC CO LTD 发明人 TANAKA TAKAO;IKUMI YONEZO
分类号 F25B43/04;(IPC1-7):F25B43/04 主分类号 F25B43/04
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