发明名称 PARTIAL SOLDERING PROCESS AND SYSTEM
摘要 PROBLEM TO BE SOLVED: To improve productivity of partial soldering. SOLUTION: There are provided a flux applying process 2, where a flux is applied to a partial soldering part of a substrate at which partial soldering, is performed, a preliminary heating process 3 where at least a partial soldering part of the substrate with the flux coated is preliminary heated, while the substrate is transported, and a partial soldering process 4 where the partial soldering part of the substrate which has been preliminary heated is soldered.
申请公布号 JP2001085828(A) 申请公布日期 2001.03.30
申请号 JP19990259620 申请日期 1999.09.13
申请人 SUZUKA FUJI XEROX CO LTD 发明人 TANIGUCHI SHINJI
分类号 B23K1/00;B23K1/20;B23K3/00;B23K3/04;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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