| 摘要 |
PROBLEM TO BE SOLVED: To obtain both a front surface analysis and a rear surface analysis at a low cost in a short TAT in a semiconductor device evaluation analysis using a photodetection of a semiconductor chip. SOLUTION: The analyzing prober 10 comprises a board 1 having a size equivalent to that of a semiconductor wafer, a quartz plate 2 provided in an opening of the board 1, and a manipulator 5 provided on the board 1. A semiconductor chip 4 is pressed on the plate 4 and fixed by utilizing a pressure of a probe 6 in the case of probing. When front surface analyzed, the prober 10 is mounted as shown in FIG. (a) on a wafer stage 12 of a normally used wafer analyzer, and analyzed by utilizing an optical system 11 while electrically inputting by the probe 6. When rear surface analyzed, a detachable plate 7 is mounted, the prober 10 is reversed back side front as shown in FIG. (b), mounted on the stage 12, and analyzed by utilizing the system 11 while electrically inputting by the probe 6.
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