| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit that can achieve equal wiring length, and a memory module that has the semiconductor integrated circuit. SOLUTION: A memory chip includes a plurality of pins Q and D0 to D3. The plurality of pins are divided into two rows for arranging both the end parts of the memory chip. All data I/O pins D0 to D3 are arranged at the side (the same row) of a package 1. When a memory module is configured each memory chip is arranged, so that the data I/O pins D0 to D3 are placed so that they are nearest the center line of a module substrate which is parallel to a group of connect pins, thus substantially equalizing the wiring length of each memory chip to that of the connection pin.
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