发明名称 DIFFUSION FURNACE AND CLEANING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To avoid abnormal etching cleaning of a reaction pipe and to save energy. SOLUTION: Plural semiconductor substrates are installed in a reaction pipe 1, and the semiconductor substrate is heated to a prescribed temperature through the reaction pipe 1. An impurity gas is supplied into the reaction pipe 1, and impurity is made to diffuse into the semiconductor substrate. The reaction pipe 1 is used by positioning opening parts 1a and 1b at both ends in the vertical direction and always installing the inner wall 1c of the reaction pipe 1 in a vertical attitube. Cleaning medical liquid is jetted in a shower form from the upper opening part 1a of the reaction pipe 1 and is supplied into the reaction pipe 1. Cleaning waste liquid is discharged from the lower opening part 1b side of the reaction pipe 1.
申请公布号 JP2001085345(A) 申请公布日期 2001.03.30
申请号 JP19990262554 申请日期 1999.09.16
申请人 NEC KYUSHU LTD 发明人 IDE SHIGEAKI
分类号 H01L21/22;B01J19/00;H01L21/00;(IPC1-7):H01L21/22 主分类号 H01L21/22
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