| 摘要 |
PROBLEM TO BE SOLVED: To promote thinning a semiconductor device having two resin-sealed semiconductor chips and suppress the reduction of the solder connection life due to a difference in thermal expansion coefficient between a substrate of the semiconductor device and the semiconductor chips. SOLUTION: The device is a chip size package(CSP) having to chips 1A, 1A which are laminated back to back, fixed to the top surface of a base substrate 5 through an elastomer sheet 4, and sealed with a mold resin 2. The elastomer sheet 4 is made of a material having a higher modulus of elasticity than the base substrate 5 and relaxes or absorbs stresses caused by a difference in thermal expansion coefficient between the substrate mounting the CSP and the chip 1A and suppresses the reduction of the connection life of bump electrodes 9. The two chips 1A, 1A are electrically connected to a Cu wiring 6 formed on one surface of the base substrate 5 through wires 8A, 8B. |
