| 摘要 |
PROBLEM TO BE SOLVED: To reduce transmission loss and distortion of a high-frequency signal and also reduce package size. SOLUTION: This optical semiconductor device module consists of a V groove 9 for installing an optical fiber that is formed on the main surface along the light axis of a light semiconductor device 5 placed on the main surface of a silicon substrate 1, an input electrode 10a and an output electrode 10b of the light semiconductor device 5 formed near the light semiconductor device 5, a coaxial line-shaped wiring 11 that is formed in the input electrode 10a and the output electrode 10b, while a central line conductor is provided in a through-hole for penetrating a main surface and the other main surface, and a filled insulator is provided around it, and a base substrate 16 that has a terminal electrode 7a for input and a terminal electrode 7b for output which is connected directly to the coaxial line-shaped wiring 11 and is joined to the other main surface side of the silicon substrate 1.
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