PACKAGE, AND ELECTRONIC DEVICE USING THE SAME, AND LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To make a semiconductor laser package compact in size and also to suppress the spurious irradiation of high frequency applied to a semiconductor chip. SOLUTION: For a semiconductor laser package 32, a semiconductor laser chip 1 is bonded to a package base board 2, and the above package board 2 is provided with an electrode terminal 15 piercing vertically. A semiconductor laser package 32 which has the semiconductor laser chip 1 stored is constitutied. Then, the electrode terminal 5 piercing the package board is constituted of a conductive material sandwiched between two or more layers of insulating materials 16 and 17, and an electrode is formed.