| 摘要 |
PROBLEM TO BE SOLVED: To realize size reduction, thinning and the cost reduction of the chip size package of a semiconductor device of high heat generation (high-speed operation). SOLUTION: This semiconductor device has a chip-size package, consisting of a TAB tape 11, whereon a semiconductor element 12 is mounted, a stiffener 15,and a heat sink 16, as sealing form, and is of such a constitution that the heat sink sticks fast to the rear of a semiconductor element 12 via only a sheet- shaped adhesive material 16a common to the periphery, without using special liquid-form adhesive material or the like, by forming a slit 16b in the heat sink 16 and thereby allowing the region 16c for sticking fast to an element at the center of the heat sink 16, to transform flexibly in the direction of approaching the semiconductor element 12 at assemblying.
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