SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF, CIRCUIT BOARD AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To constitute a structure of a plurality of stacked semiconductor chips inexpensively. SOLUTION: A multi-chip semiconductor device 1 comprises a plurality of stacked semiconductor devices 10 each having a wiring pattern 22 formed from one surface side to the other surface side of a semiconductor chip 30. A first connecting part 24 is located on one surface side of the semiconductor chip 30 while a second connecting part 26 is located on the other surface side thereof and a pair of semiconductor devices 10 are connected electrically through the first or second connecting part 24, 26.