发明名称 PAD FOR MOUNTING COMPONENT OF PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a pad for mounting the components of printed board, which can improve the efficiency in work of inspection processes by making the quality of soldering easily distinguishable with accuracy, without causing positional deviation of surface-mounting components at fixing of the components on the pad through soldering by using cream solder applied to the pad. SOLUTION: A pad 30 for mounting components is constituted of a circular first pad 32, which has nearly the same size as the bottom electrode of a surface-mounting components has and two lead-out sections 36 and 36 and a second pad 34, which is arranged separately from the pad 32 and the lead-out sections 36 are formed, so that the sections 36 protrude outward from the outer periphery of the parts. The quality of soldering is discriminated, based on the solder filters which are left on the lead-out sections 36 after reflow.
申请公布号 JP2001085825(A) 申请公布日期 2001.03.30
申请号 JP19990258181 申请日期 1999.09.13
申请人 KEIHIN CORP 发明人 SHOJI MASAHIKO
分类号 H05K3/34;H05K1/18;(IPC1-7):H05K3/34 主分类号 H05K3/34
代理机构 代理人
主权项
地址