| 摘要 |
PROBLEM TO BE SOLVED: To connect electronic parts and a circuit board with good conductivity and to improve adhesion strength by using cement for mounting electronic parts comprising respectively specified amounts of epoxy resin, latent hardener and conductive particle. SOLUTION: In cement, 2 to 30 pts.wt. of latent hardener, 10 to 30 pts.wt. if desirable and 30 to 900 pts.wt. of conductive particles are mixed with respect to 100 pts.wt. of epoxy resin. When the mixing quantity of latent hardener becomes below 2 pts.wt., the curing of cement 3 tends to be come slow and curing tends to become insufficient. When it exceeds 30 pts.wt., the preservation stability of adhesive 3 tends to deteriorate and the material of cured cement 4 tends to deteriorate. When the mixing quantity of conductive particles becomes below 300 pts.wt., sufficient conductivity cannot be obtained and thixotropy become insufficient. When it exceeds 900 pts.wt., the viscosity of cement 3 becomes high and handling workability is deteriorated.
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