| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solder bridge and a solder defect and to improve quality by forming plural protrusions on a board and positioning and arranging a surface mounted part on the board by adjusting it to the protrusions. SOLUTION: A plurality of protrusions 5 are formed on a printed board 1, and a surface mounted part 2 is positioned/arranged on the board 1 by making it follow the protrusions 5. The protrusions 5 are formed of solder resist and the like and they are installed outside a land 4. On mounting the surface mounted part 2 on the printed wiring board 1, the leads 3 of the surface mounted part positioned by a man's hand or in the mounted unit of a mounter can precisely be positioned on the land 4 of the printed wiring board 1. Since the positioned surface mounted part 2 is fixed by the projections 5 until soldering is fixed, it is prevented from being dislocated. Then, a solder bridge and a solder defect are prevented and quality can be improved.
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