| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition excellent in resolving power, developer resistance, sandblast resistance, etc. SOLUTION: The photosensitive resin composition contains a carboxyl- containing urethane acrylic resin (A) obtained by reacting a carboxyl-containing diol compound and a diol compound having an average molecular weight of <=500 and no acid value with a polyisocyanate compound and reacting the resulting urethane compound with a compound having one or more ethylenically unsaturated groups and one hydroxyl group, a urethane acrylic resin (B) of the formula and a photopolymerization initiator (C). Preferably the composition further contains a carboxyl-containing acrylic polymer (D) having 50-250 mgKOH/g acid value. In the formula, R1 is the urethane bond residue of a compound having one or more ethylenically unsaturated groups and one hydroxyl group, R2 is the both-end urethane bond residue of a polyisocyanate compound, R3 is the both-end urethane bond residue of a polyol or a polyester polyol having an average molecular weight of 500-10,000 and (m) is an integer of 1-20. |
