| 摘要 |
<p>PURPOSE:To easily take out a semiconductor chip, to easily execute a cleaning operation, to easily maintain the degree of cleanliness, to easily execute an automatic recognition operation and to prevent an electrostatic breakdown by a method wherein a groove is formed at the bottom of a recessed part used to house the semiconductor chip, cutout parts are provided at individual sides of bank parts at the outer circumference of the recessed part and a black conductive material is used for a material of a chip tray. CONSTITUTION:A black conductive material is used for a material of a chip tray 1 in order to prevent a breakdown by static electricity of a semiconductor chip 4 and to automatically recognize it. At least one cutout part 6 is formed at each side of banks 6 at the outer circumference part of four sides in order to maintain a degree of cleanliness of the chip tray 1 and to enhance a cleaning property. In addition, a cross-shaped groove 2 having a depth of about 0.1 to 1.0mm is arranged at the bottom of a recessed part 5 in order to easily take out the semiconductor chip. Thereby, an automatic recognition operation can be executed easily; it is possible to prevent an electrostatic breakdown of the semiconductor chip; a cleaning operation can be executed easily; a degree of cleanliness can be maintained easily; the chip can be taken out easily.</p> |
