Apparatus for magnetron sputtering comprises targets surrounded by a plasma electrode open to the substrate and peripheral to its sputtering surface

摘要

Apparatus for magnetron sputtering comprises targets (1,2) surrounded by a plasma electrode (9,10) open to the substrate (27) and peripheral to its sputtering surface. A selective potential can be applied to the electrode. A number of gas outlet openings (13) are provided between the targets and the electrode or directly on the electrode, the openings being connected to a gas feed device (21). Preferred Features: At least one part of the plasma electrode protrudes over the sputtering surface of the targets in the direction towards the substrate by an amount that corresponds to a quarter of the distance between the targets and the substrate.