发明名称 BONDING METHOD FOR SKIN
摘要 PROBLEM TO BE SOLVED: To provide a bonding method for skin which can reduce the number of locking pins, permit bonding to be conducted on the base material of a skin even for a product whose shape is complicated or much recessed, and can attain smooth and fine finishing even for a skin whose elongation is poor. SOLUTION: After a skin 3 is set on a cavity mold 1, decompression and suction is conducted from a through hole 12 formed at the mold surface 1a of the cavity mold 1 while a clearance between the peripheral edge 31 of the skin and the cavity mold 1 is being sealed, and the skin 3 is made to follow the mold surface 1a. A mold 2 where a base material 4 is locked is then lowered, and the skin is brought into pressure contact and bonded onto the surface of the base material through adhesives applied to the skin 3 or the base material 4 beforehand. The base material 4 is left on the cavity mold 1, and the mold 2 is raised. After the peripheral edge 31 of the skin is disposed on the back surface side of the base material 4, the mold 2 is lowered again, and the peripheral edge 31 of the skin is included and bonded on the base material back surface side.
申请公布号 JPH09109266(A) 申请公布日期 1997.04.28
申请号 JP19950292134 申请日期 1995.10.13
申请人 INOAC CORP 发明人 ISHIKAWA HIYOSHI;ICHIO TOSHIMICHI;YOSHIMOTO JUNJI
分类号 B29C51/16;B29C51/10;B29C63/04;B29C65/48;B29C65/70;B29L9/00;B29L31/58;(IPC1-7):B29C65/48 主分类号 B29C51/16
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