发明名称 |
EPOXY RESIN COMPOSITION AND RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE |
摘要 |
<p>The present invention provides an epoxy resin composition that gives a cured product having rapid curability, excellent fluidity, low moisture absorption and adhesiveness, and a resin encapsulation-type semiconductor device having excellent solder crack resistance, encapsulated with this composition. An epoxy resin composition comprising a blend of (a) an epoxy resin, (b) a compound having two or more phenolic hydroxyl groups on the average in one molecule and (c) a cationic polymerization catalyst for epoxy resin, as the essential components, and a semiconductor device encapsulated with this composition.</p> |
申请公布号 |
WO0121697(A1) |
申请公布日期 |
2001.03.29 |
申请号 |
WO2000EP09187 |
申请日期 |
2000.09.15 |
申请人 |
SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.;HAYAKAWA, ATSUHITO;MURATA, YASUYUKI |
发明人 |
HAYAKAWA, ATSUHITO;MURATA, YASUYUKI |
分类号 |
C08G59/24;C08G59/62;C08G59/68;C08K5/00;C08K5/13;H01L23/29;H01L23/31;(IPC1-7):C08K5/13;C08G59/42 |
主分类号 |
C08G59/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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