| 摘要 |
<p>A method for arranging light emitting device array chips in which defective chips can be removed completely. A plurality of rectangular self-scanning light-emitting device array chips each comprising an array of light-emitting device so arranged linearly to face one end, and a plurality of bonding pads provided at the other end are staggered on a substrate. The first end of the chips are arranged such that the light emitting devices are arranged at regular pitches and do not overlap with each other in the direction orthogonal to the direction of arrangement of the chips, and the other ends of the chips are arranged such that the light-emitting devices are arranged at regular pitches and overlap with each other in the direction orthogonal to the direction of arrangement of the chips.</p> |
