| 摘要 |
Microelectromechanical structures include first and second movable conductiv e members that extend along and are spaced apart from a microelectronic substrate and are spaced apart from one another, and a movable dielectric li nk or tether that mechanically links the first and second movable conductive members while electrically isolating the first and second movable conductive members from one another. The movable dielectric link preferably comprises silicon nitride. These microelectromechanical structures can be particularly useful for mechanically coupling structures that are electrically conducting , where it is desired that these structures be coupled in a manner that can reduce and preferably prevent electrical contact or crosstalk. These microelectromechanical structures can be fabricated by forming a sacrificial layer on a microelectronic substrate and forming a dielectric link on the sacrificial layer. First and second spaced apart conductive members are electroplated on the sacrificial layer, such that the first and second space d apart conductive members both are attached to the dielectric link. The sacrificial layer is then at least partly removed, for example by etching, t o thereby release the dielectric layer and at least a portion of the first and second conductive members from the microelectronic substrate.
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