| 摘要 |
<p>A solder-bearing wafer (100) is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and a second surface opposing the first surface. The first surface has grooves (115, 117) formed therein and includes lengths of solder (130) disposed within the grooves. Upon heating of the solder and placement of the wafer between the first and second devices, the two devices are connected.</p> |
