发明名称 Speicherzellenanordnung und Verfahren zu deren Herstellung
摘要 In a memory cell arrangement which includes vertical MOS transistors as the memory cells, information is stored by different threshold voltages of the transistors. Dopant regions are formed for an information state by angular implantation or diffusion in the upper part of the channel region. The lower part of the channel region is consequently covered by an etching residue (9') which is produced by a masked spacer etching. The arrangement can be produced with a surface requirement of 2 F<2> (F being the minimum structural size) per memory cell.
申请公布号 DE19609678(A1) 申请公布日期 1997.09.18
申请号 DE19961009678 申请日期 1996.03.12
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 HOFMANN, FRANZ, DR., 80995 MUENCHEN, DE;WILLER, JOSEPH, DR., 85521 RIEMERLING, DE;KRAUTSCHNEIDER, WOLFGANG, DR., 83104 TUNTENHAUSEN, DE
分类号 H01L21/8246;H01L27/112;(IPC1-7):H01L27/112;H01L21/824;G11C17/10 主分类号 H01L21/8246
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