发明名称 Repeated firing resistant ceramic circuit substrate
摘要 A low temperature fired ceramic circuit substrate has laminated insulating layers of ceramic fired at 800-1000 deg C, a silver-based conductive wiring in the inner insulating layer and a gold-based conductive wiring on the surface insulating layer, the novelty being that a metallic interlayer (16), formed from a gold/silver-based thick film paste, is provided between the inner layer wiring (15) and the surface layer wiring (17). Preferably, the gold-silver material contains 10-80 wt.% Au and 90-20 wt.% Ag.
申请公布号 DE19707253(A1) 申请公布日期 1997.09.18
申请号 DE1997107253 申请日期 1997.02.24
申请人 SUMITOMO METAL (SMI) ELECTRONICS DEVICES INC., MINE, YAMAGUCHI, JP 发明人 KAWAKAMI, KATSUYA, TOYOAKE, AICHI, JP;FUKUTA, JUNZO, NAGOYA, AICHI, JP
分类号 H05K1/09;H01L21/48;H01L23/498;H01L23/538;H05K1/03;H05K3/24;H05K3/40;H05K3/46;(IPC1-7):H05K3/46;H05K1/02 主分类号 H05K1/09
代理机构 代理人
主权项
地址