摘要 |
A low temperature fired ceramic circuit substrate has laminated insulating layers of ceramic fired at 800-1000 deg C, a silver-based conductive wiring in the inner insulating layer and a gold-based conductive wiring on the surface insulating layer, the novelty being that a metallic interlayer (16), formed from a gold/silver-based thick film paste, is provided between the inner layer wiring (15) and the surface layer wiring (17). Preferably, the gold-silver material contains 10-80 wt.% Au and 90-20 wt.% Ag. |
申请人 |
SUMITOMO METAL (SMI) ELECTRONICS DEVICES INC., MINE, YAMAGUCHI, JP |
发明人 |
KAWAKAMI, KATSUYA, TOYOAKE, AICHI, JP;FUKUTA, JUNZO, NAGOYA, AICHI, JP |